MANUFACTURING METHOD OF COF FILM CARRIER TAPE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a COF film carrier tape which improves the reliability and productivity of an IC-chip mounting line without fusing thermally any insulator layer on a heating tool or stage. SOLUTION: The manufacturing method is the one of a COF film carrier tape 20 having an insulation layer 12 and having wiring patterns 21 obtained by patterning a conductor layer 11 laminated on the one-sided surface of the insulation layer 12. After the photolithography process for performing the foregoing patterning, the process for forming a mold releasing agent layer 13 on the insulation layer 12 is performed. COPYRIGHT: (C)2004,JPO