| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device which hardly has a crack in a substrate, a glaze layer, or a semiconductor chip and causes no sagging in a sealing layer. <P>SOLUTION: The device has the substrate, the semiconductor chip mounted on the substrate, and the sealing layer covering the semiconductor chip for sealing. The sealing layer has a silicone-based material. <P>COPYRIGHT: (C)2004,JPO |
