PACKAGING STRUCTURE OF ELECTRONIC COMPONENT AND BOARD USED THEREFOR AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To increase an injection property in a reinforcing resin when injecting the reinforcing resin between an electronic component packaged onto a board via a conductive jointing material and the board.

SOLUTION: The packaging structure of the electronic component comprises the board 10 having a land 20 on one surface, the electronic component 30 electrically connected to the land 20 mounted onto one surface of the board 10 via the conductive jointing material 40, and the reinforcing resin 50 filled between the electronic component 30 and the board 10. The land 20 is formed by a print method and is raised from one surface of the board 10.

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