发明名称 |
Connecting solder partners used in die bonding or chip bonding comprises heating the solder partners so that a solder depot melts and is pulled by capillary forces into a joining region to join the solder partners |
摘要 |
Connecting a first solder partner (20) to a second solder partner (10) comprises placing the first solder partner, the second solder partner and a solder depot (30) so that one surface (20a) of the first solder partner lies opposite one surface (10a) of the second solder partner, and heating the solder partners so that the solder depot melts and is pulled by capillary forces into a joining region to join the solder partners through a joining layer. An Independent claim is also included for a composite arrangement made from the solder partners. |
申请公布号 |
DE10252577(A1) |
申请公布日期 |
2004.05.27 |
申请号 |
DE2002152577 |
申请日期 |
2002.11.12 |
申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
OPPERMANN, HERMANN;HUTTER, MATTHIAS |
分类号 |
B23K1/00;H01L21/60;(IPC1-7):B23K1/00;B23K1/19 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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