| 摘要 |
A semiconductor device includes a stable high withstand voltage lateral MISFET device which suppresses a gradual withstand voltage drop under high voltage and humidity conditions. In a MISFET device with a 700V breakdown drain voltage, the length of extension Mc (mum) of a field plate FP1 from the source side end of a thermal oxidization film, and the total insulating film thickness Tox (mum) directly below the extending tip of the field plate FP1, are greater than or equal to lower limit values Mcmin, Tcmin. As a result, even if there is growth in charge accumulation at the interface of the mold resin, the field strength at a point B and point C is always lower than at a point A, which suppresses a gradual withstand voltage drop and a gradual ON current drop, whereby it becomes possible to realize a withstand voltage of 700V.
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