发明名称 |
FLIP-CHIP SYSTEM AND METHOD OF MAKING SAME |
摘要 |
A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that alone exhibits a CTE that is characteristic of an inorganic-filled underfill composite previously known. An embodiment is also directed to the assembly of a flip-chip package that uses an underfill mixture. |
申请公布号 |
AU2003284902(A1) |
申请公布日期 |
2004.05.25 |
申请号 |
AU20030284902 |
申请日期 |
2003.10.23 |
申请人 |
INTEL CORPORATION |
发明人 |
SONG-HUA SHI;TIAN-AN CHEN |
分类号 |
C08L63/00;C08L65/00;H01L21/56 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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