发明名称 APPARATUS FOR CUTTING GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for cutting a glass substrate which shortens time required for scribing all cutting lines. SOLUTION: The apparatus has a structure comprising a working stage 31 onto which the glass substrate A is supplied, a first runner 35 on the front and a second runner 36 on the back which are guided by appropriate guiding means 32 and reciprocated back and forth across the working stage by appropriate running means 33 and 34, at least two first cutters 44 established on the first runner, sliders 47 and 48 established on the first and second runners which are guided by appropriate guiding means 45 and reciprocated in right and left direction by appropriate running means and a second cutter 52 and a third cutter 53 established on the sliders on the first and second runners, respectively. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004142960(A) 申请公布日期 2004.05.20
申请号 JP20020306598 申请日期 2002.10.22
申请人 SHIRAITEKKU:KK 发明人 SHIRAI AKIRA
分类号 C03B33/02;C03B33/03;(IPC1-7):C03B33/03 主分类号 C03B33/02
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