| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a composite multilayer substrate which can transmit a signal without intermediary of a pin terminal, etc. by exposing a metal core layer to a side face of a package and using the core layer as an electrical connecting terminal, and which can reduce a transfer loss in a high frequency wave application, and to provide a module using the same. <P>SOLUTION: The composite multilayer substrate 40 includes a core member 41, a resin layer (42, 43) covering the member 41, and holes 44-47 without bottoms formed at the member through front and rear surfaces of the member 41. Electronic parts 48-51 are respectively mounted in the holes 44-47 for use. Exposed parts (41a, 41b) are provided on the surfaces (end faces) except the front and rear surfaces of the member 41. <P>COPYRIGHT: (C)2004,JPO</p> |
