| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum/purging method for a load lock chamber for manufacturing a semiconductor device that prevents a contamination and a damage on a wafer. SOLUTION: A semiconductor manufacturing facility comprises a load lock chamber in a sealed atmosphere, a vacuum pump for supplying a vacuum pressure through a pipe line connected to the load lock chamber, a gas supply section for supplying purge gas through a gas supply pipe connected to the load lock chamber, control valves which are respectively installed on the pipe and the gas supply pipe so as to control the supply of the vacuum pressure and the purge gas, and a control section for controlling the driving of the vacuum pump, the gas supply section, and the control valves. The vacuum/purging method for the load lock chamber in the semiconductor manufacturing facility comprises a step of supplying the vacuum pressure and the purge gas in a synchronous manner when the pressure in the load lock chamber is changed, and a step of gradually reducing the supply of one of the vacuum pressure and the purge gas to interrupt the supply. COPYRIGHT: (C)2004,JPO |
