| 摘要 |
An IR cut-filter is fitted into a support portion within the optical-system containing portion of a ceramic board and a lens 11 is mounted in the ceramic board by screwing the lens. In an imaging-device containing portion, an imaging device with a light receiving portion arranged therein is mounted outside the support portion by flip-chip packaging. Further, the vicinity of the flip-chip packaging portion is sealed with resin. Additionally, on the base of the imaging-device containing portion of a ceramic package, the lands of an imaging device are so positioned as to correspond to the respective land positions of a ceramic package and patterns are electrically connected by melting a gold bump, whereby the imaging device is mounted by bare-chip packaging. The land portion is filled with an underfill agent and then sheet glass is mounted on a through-hole 5b and sealed with a sealing agent, so that the through-hole 5b for containing a light receiving portion is sealed up.
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