发明名称 |
INTEGRATED PLATING AND PLANARIZATION APPARATUS HAVING A VARIABLE-DIAMETER COUNTERELECTRODE |
摘要 |
An apparatus for plating and planarizing metal on a substrate includes a plurality of dispensing segments, each having at least one hole for dispensing electroplating solution onto the substrate. The dispensing segments form a circular counterelectrode and are movable with respect to each other during an electroplating process, so that the counterelectrode has a variable diameter. The electroplating solution is thus dispensed on an annular portion of the substrate having a diameter corresponding to the diameter of the counterelectrode; accordingly, the variable-diameter counterelectrode permits localized delivery of the plating solution to the substrate. |
申请公布号 |
US2004094403(A1) |
申请公布日期 |
2004.05.20 |
申请号 |
US20020294199 |
申请日期 |
2002.11.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ECONOMIKOS LAERTIS;DELIGIANNI HARIKLIA;COTTE JOHN M.;ANDRICACOS PANAYOTIS C. |
分类号 |
C25D5/04;C25D5/48;C25D7/12;C25D17/00;C25D21/00;C25F3/12;C25F7/00;H01L21/288;(IPC1-7):C25D17/10 |
主分类号 |
C25D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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