| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in adhesiveness to substrates, flame retardance and resistance to stress by soldering without using a bromine-containing organic compound and an antimony compound. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin represented by formula (1), (B) a phenol resin represented by formula (2), (C) an inorganic filler, (D) a hardening accelerator and (E) phenoxathiin as essential components, and total inorganic material is contained in an amount of≥84 wt.% and≤94 wt.% based on the total epoxy resin composition. COPYRIGHT: (C)2004,JPO
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