| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device that can prevent the bad influence of bumping from being exerted upon a substrate by detecting the occurrence of the bumping and suppressing the bumping. SOLUTION: When a control unit 41 judges that the surface of a treating liquid is in a bumping state, the unit 41 widens the clearance between the upper end of a treating vessel 3 and the lower surface of an opening/closing door 9 in the upper part of the vessel 3 by means of a clearance adjuster 45. Consequently, the liquid level moves in the direction in which the concentration of the treating liquid becomes higher, because the amount of water evaporating from the treating liquid through the clearance increases. Therefore, the bumping can be suppressed, because the boiling point of the treating liquid rises as the concentration of the liquid becomes higher even when the temperature of the liquid reaching the boiling point does not change. Consequently, the bad influence of the bumping can be prevented from being exerted upon the substrate W while the substrate W is treated. COPYRIGHT: (C)2004,JPO
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