Non-thermal process for forming porous low dielectric constant films
摘要
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion of at least one pore-forming phase within a multiphasic film thereby forming a porous film. The pore-forming phase may be removed via exposure to at least one energy source, preferably an ultraviolet light source, in a non-oxidizing atmosphere.
申请公布号
EP1420439(A2)
申请公布日期
2004.05.19
申请号
EP20030025722
申请日期
2003.11.10
申请人
AIR PRODUCTS AND CHEMICALS, INC.
发明人
LUKAS, AARON SCOTT;BITNER, MARK DANIEL;VRTIS, RAYMOND NICHOLAS;O'NEILL, MARK LEONARD;VINCENT, JEAN LOUISE;KARWACKI, EUGENE JOSEPH, JR.