发明名称 PLASMA TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus, capable of controlling process progress, by enabling a detection section to detect the termination point of the process to the inside of a chamber, where the process is conducted. SOLUTION: The plasma treatment apparatus comprises a chamber 12, where the process is executed; a confirmation window that is a transparent material, is installed on one sidewall of the chamber 12, and has a groove 22 having a specific depth from the inner wall of the chamber 12; a heater 24 heated so that heat is concentrated at the site of the groove 22 in the confirmation window; and the detection section 16 for detecting changes in the process at the inside, from the outside of the chamber 12 to the site of the groove 22 in the confirmation window. A projection 26 is formed at the site of the confirmation window facing the detection section 16, and the heater 24 is provided so that heat is supplied around the periphery including the projection 26. A polymer derivative section 28 for inducing the deposition of polymer is provided at the periphery of the confirmation window, and a liner 30 for facilitating the removal of the polymer is provided on the surface of the polymer inducing section 28. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140324(A) 申请公布日期 2004.05.13
申请号 JP20030166568 申请日期 2003.06.11
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 LEE SHIN-SANG
分类号 H01L21/3065;H01J37/32;H01L21/66;(IPC1-7):H01L21/306 主分类号 H01L21/3065
代理机构 代理人
主权项
地址