发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an electronic component mounting device improved in the reliability of electric connection of electronic components. SOLUTION: The electronic component mounting device is provided with a main circuit substrate 1, an electronic circuit module 3 provided on the main circuit substrate 1 to accommodate the electronic component in a module vessel 2, and a casing 4 for receiving the main circuit substrate 1 and the electronic circuit module 3. A fixing site 11, connected to the casing 4, is formed on the electronic circuit module 3 and the electronic circuit module 3 is fixed to the casing 4 by screws 13 at the fixing site 11. Further, metallic fine wire terminals 14, led out of the electronic circuit module 3, are electrically connected to the main circuit substrate 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004140146(A) 申请公布日期 2004.05.13
申请号 JP20020302823 申请日期 2002.10.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 UMADONO SHINJI;NISHIKAWA TETSUYA
分类号 H01L25/18;H01L25/04;(IPC1-7):H01L25/04 主分类号 H01L25/18
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