摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component mounting device improved in the reliability of electric connection of electronic components. SOLUTION: The electronic component mounting device is provided with a main circuit substrate 1, an electronic circuit module 3 provided on the main circuit substrate 1 to accommodate the electronic component in a module vessel 2, and a casing 4 for receiving the main circuit substrate 1 and the electronic circuit module 3. A fixing site 11, connected to the casing 4, is formed on the electronic circuit module 3 and the electronic circuit module 3 is fixed to the casing 4 by screws 13 at the fixing site 11. Further, metallic fine wire terminals 14, led out of the electronic circuit module 3, are electrically connected to the main circuit substrate 1. COPYRIGHT: (C)2004,JPO
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