| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems wherein a conductive material is liable to separate from a thermoelectric semiconductor due to a thermal expansion coefficient difference between a heat dissipating board and a thermoelement because metal interconnect lines formed on the heat dissipating board are electrically connected to the thermoelectric semiconductor provided with a conductive material formed on its front surface with solder or a conductive adhesive agent in a thermoelement having a conventional structure, the thermoelement can not be set high enough in reliability and performance because an electrical connection is liable to be often disconnected in a heat cycle test, and the thermoelement is restrained from being reduced in size due to the fact that the thickness of the heat dissipating board causes increase in the thickness of the whole thermoelement. SOLUTION: The p-type thermoelements and the n-type thermoelements are alternately arranged through the intermediary of an insulator. The thermoelements are electrically connected together with metal members and metal interconnect lines, the surfaces of the metal interconnect lines and the insulators are protected by an insulating layer containing thermally conductive particles and catalytic metal particles, and a metal layer is formed on the surface of the insulating layer. COPYRIGHT: (C)2004,JPO
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