发明名称 |
Large line conductive pads for interconnection of stackable circuitry |
摘要 |
Digital circuitry, such as interconnective pads which are patterned as waffles according to the embossing methods for flexible substrates which are disclosed, so as to be especially suited for the interconnection of stacks of circuitry blocks forming digital memory known as Permanent Inexpensive, Rugged Memory (PIRM) cross point arrays.
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申请公布号 |
US2004090843(A1) |
申请公布日期 |
2004.05.13 |
申请号 |
US20030696992 |
申请日期 |
2003.10.30 |
申请人 |
PERLOV CRAIG;TAUSSIG CARL |
发明人 |
PERLOV CRAIG;TAUSSIG CARL |
分类号 |
G06K19/077;H01L21/027;H01L23/12;H05K1/11;H05K3/00;H05K3/06;H05K3/20;(IPC1-7):G11C29/00 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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