发明名称 |
Plating method |
摘要 |
The present invention provides compositions and methods for immersion depositing highly adherent silver layers. The compositions contain silver ions, water and a carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.
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申请公布号 |
EP1418251(A1) |
申请公布日期 |
2004.05.12 |
申请号 |
EP20030255295 |
申请日期 |
2003.08.26 |
申请人 |
SHIPLEY COMPANY LLC |
发明人 |
RZEZNIK, MARIA ANNA;JACQUES, DAVID L. |
分类号 |
C23C18/42;H01L21/28;H01L21/288;H05K3/18;H05K3/24;(IPC1-7):C23C18/42 |
主分类号 |
C23C18/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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