| 摘要 |
PURPOSE: An ashing apparatus and method for manufacturing a semiconductor device are provided to prevent polymers from being deposited on a predetermined portion of a chamber inner wall. CONSTITUTION: An ashing apparatus for manufacturing a semiconductor device is provided with a process chamber(200) for carrying out an ashing process, a loadlock chamber(100) for preventing particles from being flowed into the process chamber, a plurality of stages(211,212,213,214,215,216) uniformly arrayed in the process chamber for loading semiconductor substrates, and a heater(221) for heating the plurality of stages. The ashing apparatus further includes a transfer part(300) for sequentially moving the semiconductor substrates to the stages and loadlock chamber. The transfer part changes the moving direction of the semiconductor substrate as much as a predetermined interval between stages.
|
