发明名称 |
Romoving sacrificial material by thermal decomposition |
摘要 |
A thermally decomposable sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The thermally decomposable sacrificial material may be removed without damaging or removing the dielectric layer. The thermally decomposable sacrificial material may be a combination of organic and inorganic materials, such as a hydrocarbon-siloxane polymer hybrid.
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申请公布号 |
US2004087060(A1) |
申请公布日期 |
2004.05.06 |
申请号 |
US20020287369 |
申请日期 |
2002.11.04 |
申请人 |
MEAGLEY ROBERT P.;MOON PETER K.;O'BRIEN KEVIN P. |
发明人 |
MEAGLEY ROBERT P.;MOON PETER K.;O'BRIEN KEVIN P. |
分类号 |
H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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