IMPROVEMENTS IN OR RELATING TO COOLING OF ELECTRONIC COMPONENTS
摘要
Described herein is a method of cooling electronic components which does not rely on conventional convection cooling techniques. A ball grid array (BGA) (24) is mounted on a printed circuit board (PCB) (22). A heat spreading plate (42) covers the BGA (24) and has a hole (46) formed therein for accommodating a metal disk (48). The disk (48) is preferably located in the hole (46) by means of an interference fit. An interface layer (50) is provided between the BGA (24) and the disk (48) to enhance conduction of heat away from the BGA (24) and through the disk (48). The disk (48) and interface layer (50) form a heat path to dissipate heat from the BGA (24) to the plate (42) and then to a finning arrangement (52) which is cooled by a gas or liquid flow passing over and through the arrangement (52).
申请公布号
WO2004025728(A3)
申请公布日期
2004.05.06
申请号
WO2003GB03859
申请日期
2003.09.05
申请人
BAE SYSTEMS PLC;FERGUSON, WILLIAM, ERIC;DALGLISH, PETER