发明名称 THERMALLY CONDUCTIVE EMI SHIELD
摘要 <p>Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink</p>
申请公布号 WO2004037447(A1) 申请公布日期 2004.05.06
申请号 WO2003US33353 申请日期 2003.10.21
申请人 LAIRD TECHNOLOGIES, INC.;JOHNSON, RICHARD, NORMAN 发明人 JOHNSON, RICHARD, NORMAN
分类号 B05D5/12;B32B9/00;H01L23/373;H01L23/552;H05K7/20;H05K9/00;(IPC1-7):B05D5/12 主分类号 B05D5/12
代理机构 代理人
主权项
地址