发明名称 Multilayered packaging materials for electrostatic applications
摘要 A multi-layer structure comprises at least one electrostatic dissipative outer layer and a conductive core layer. The outer layer comprises a material selected from the group consisting of an inherently dissipative polymer, an inherently dissipative polymer blended with a non-conductive matrix polymer, an inherently conductive polymer blended with a non-conductive matrix polymer in an amount sufficient to impart a surface resistivity of greater than 10<5 >and less than 10<12 >ohms/square, and mixtures thereof. The core layer comprises a material selected from the group consisting of an inherently conductive polymer, an inherently conductive polymer blended with a non-conductive matrix polymer, a conductive filler blended with a non-conductive matrix polymer, and mixtures thereof. The multi-layer structure has unexpected improved electrical properties over prior art structures because the surface resistivity of the outer layer in the multi-layer structure is less than the surface resistivity of the outer layer alone or in another multi-layer structure absent contact with the core layer.
申请公布号 US6730401(B2) 申请公布日期 2004.05.04
申请号 US20010901882 申请日期 2001.07.09
申请人 EASTMAN CHEMICAL COMPANY 发明人 JACKSON WILLIAM CARL;MCWILLIAMS DOUGLAS STEPHENS
分类号 B32B27/18;B32B27/08;(IPC1-7):B32B27/08;B32B27/36;B32B33/00;B65D85/86 主分类号 B32B27/18
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