发明名称 THERMAL POWER GENERATION ELEMENT ASSEMBLY AND ARRANGEMENT STRUCTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermal power generation element which has improved strength and corrosion-proof characteristic. SOLUTION: The thermal power generation elements 15,16 are formed by joining the p-type semiconductors 17,19 and n-type semiconductors 18,20, and are molded with an electrical insulation member 24 provided to cover the surfaces of the same elements. Accordingly, since the semiconductors 17 to 20 are molded with the electrical insulation member 24 to cover the surfaces of the same conductors under the joined condition, the strength can be improved more than that of the case where the p-type semiconductor and the n-type semiconductor are baked to join the thermal electrical power generation element. Moreover, since the semiconductors 17 to 20 are formed with the coverage of the electrical insulation member 24, the semiconductors are shielded from the atmospheric air to improve corrosion-proof characteristic. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004134564(A) 申请公布日期 2004.04.30
申请号 JP20020297333 申请日期 2002.10.10
申请人 DENSO CORP 发明人 TAKAGI MASASHI
分类号 F01P11/10;H01L35/30;H01L35/32;H01L35/34;H02N11/00;(IPC1-7):H01L35/32 主分类号 F01P11/10
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