IMPROVEMENTS IN OR RELATING TO COOLING OF ELECTRONIC COMPONENTS

摘要

Described herein is a method of cooling electronic components which does not rely on conventional convection cooling techniques. A ball grid array (BGA) (24) is mounted on a printed circuit board (PCB) (22). A heat spreading plate (42) covers the BGA (24) and has a hole (46) formed therein for accommodating a metal disk (48). The disk (48) is preferably located in the hole (46) by means of an interference fit. An interface layer (50) is provided between the BGA (24) and the disk (48) to enhance conduction of heat away from the BGA (24) and through the disk (48). The disk (48) and interface layer (50) form a heat path to dissipate heat from the BGA (24) to the plate (42) and then to a finning arrangement (52) which is cooled by a gas or liquid flow passing over and through the arrangement (52).