发明名称 |
Wiring board, semiconductor device, and process for production of wiring board |
摘要 |
In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.
|
申请公布号 |
US2004080054(A1) |
申请公布日期 |
2004.04.29 |
申请号 |
US20030684423 |
申请日期 |
2003.10.15 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
CHINDA AKIRA;MATSUURA AKIRA |
分类号 |
H01L23/12;H01L23/498;H05K1/11;H05K3/24;H05K3/34;H05K3/40;(IPC1-7):H01L21/44;H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|