PRESSURE SENSITIVE ADHESIVE DOUBLE COATED TAPE AND METHOD FOR PRODUCING IC CHIP USING IT
摘要
<p>Both sides pressure sensitive adhesive tape contains an agent which generates a gas by stimulation of at least 1 side. An independent claim is also included for the manufacture of an IC chip comprising: (1) bonding a wafer to a support via the tape; (2) grinding while the wafer is fixed to the support by the tape; (3) imparting stimulation to the tape; and (4) peeling the tap from the wafer.</p>
