| 摘要 |
In a case that a bare chip has been detected as being defective from among bare chips, a good chip is mounted to the rear surface of the surface wherein the bare chips are provided to a semiconductor module substrate so that a QFC pin of the bare chip is fixed at the ground potential (GND). Thereby, the bare chip stops the output of a signal to the input/output terminals or the input of a signal from the input/output terminals. As a result, the good chip outputs an electrical signal to the input/output terminals or an electrical signal is inputted from the input/output terminals. Thereby, a semiconductor module is gained that can be repaired even in the case that a defective chip is detected after the chip has been molded into a mold resin.
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