| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin-film capacitor that is mounted as a capacitor for bypass on a printed wiring board together with an LSI, and wherein the generation of parasitic inductance is prevented by making a core substrate smaller in thickness and size and its packaging characteristic is improved. <P>SOLUTION: Grooves 21a-21e are formed in the core substrate 20, and a first conductor film 24 is formed and the grooves are filled with a first conductor. After a metallic film 25 is formed on the first conductor film, the metallic film is selectively anodized to genrate a dielectric film 26. A second conductor film 29 is formed on the dielectric film, and electrodes 33a-33e connecting with the second conductor film are formed. The rear portion of the core substrate is removed to each groove, and then electrodes 35a-35e connecting with the first conductor within each groove are formed. Thus, the capacitor is formed by the first conductor film and the second conductor film pinching the dielectric film. <P>COPYRIGHT: (C)2004,JPO |
