| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin injected substrate 10 formed by efficiently preventing resin burrs stuck to the top surface 11 of a semiconductor chip 3 and an individual piece 15 formed by cutting the required part of the resin injected substrate 10. SOLUTION: The height D of a cavity 7 in dies 1 and 2 for resin injection is made lower than the total of the height A (B) of the semiconductor chip 3 and the required thickness C of a resin member 12 to be attached to the top surface 11 of the semiconductor chip 3, and the dies 1 and 2 are clamped. Thus, the resin member 12 is pressurized and deformed by the top surface 13 of the cavity 7, and the top surface 11 of the semiconductor chip 3 is pressurized with prescribed pressurizing force through the deformed resin member 12. Then, by injecting fused resin into the cavity 7, resin 9 is injected between 8 each semiconductor chip 3 and the substrate. COPYRIGHT: (C)2004,JPO
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