发明名称 RESIN COMPOSITION AND FILM FORMING MATERIAL CONTAINING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition and a resin film therefrom, in which an amount of a silicon defoaming agent leaked around a resin film is reduced, a leveling ability is increased, a defoaming time is shortened and reliability and producibility are increased. SOLUTION: A resin solution is mixed with a liquid for treating a solvent and a silicon defoaming agent, and an inorganic filler is dispersed and further a silicon defoaming agent is incorporated therein to give the resin composition. The resin composition is printed on a substrate by a screen printing machine to give the resin film. By mixing a resin solution previously with a liquid for treating a solvent and a silicon defoaming agent and dispersing an inorganic filler to give a paste into which a silicon defoaming agent is further incorporated, an amount of the silicon defoaming agent to be added can be reduced, an amount of the defoaming agent leaked on the edge of the resin film can be reduced and repelling upon sealing parts and adhering circuits can be reduced, reliability and a leveling ability even after screen printing can be increased, and further a defoaming time can be shortened and producibility can be increased. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004124015(A) 申请公布日期 2004.04.22
申请号 JP20020293791 申请日期 2002.10.07
申请人 HITACHI CHEM CO LTD 发明人 ONOSE KATSUHIRO;HIRATA TOMOHIRO;KANEKO SUSUMU
分类号 C08L79/08;C08K3/00;C08L77/00;C08L83/00;C09D177/00;C09D179/08;C09D183/04;C09D201/00;H01L23/29;H01L23/31;(IPC1-7):C08L79/08 主分类号 C08L79/08
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