SEMICONDUCTOR PACKAGE GRIP APPARATUS

摘要

PURPOSE: A semiconductor package grip apparatus is provided to be capable of controlling the distance between a front plate fixing block and a rear plate fixing block without a disassembling process of the semiconductor package grip apparatus. CONSTITUTION: A semiconductor package grip apparatus is provided with a rear plate fixing plate(210), a plurality of finger plates(240) spaced apart from each other at the lower portion of the rear plate fixing plate, a plurality of finger units(230) spaced apart from each other at one side of each finger plate for picking up a semiconductor package, and a front plate fixing block(220) opposite to the rear plate fixing plate. The semiconductor package grip apparatus further includes a sub plate(260) for controlling the distance between the front and rear plate fixing block. At this time, the sub plate includes a stopper.