发明名称 |
Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves |
摘要 |
A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.
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申请公布号 |
US6722030(B1) |
申请公布日期 |
2004.04.20 |
申请号 |
US20000622351 |
申请日期 |
2000.11.13 |
申请人 |
EPCOS AG |
发明人 |
STELZL ALOIS;KRUEGER HANS;DEMMER PETER |
分类号 |
H01L23/02;H01L23/552;H03H3/02;H03H3/08;H03H9/05;H03H9/25;(IPC1-7):H05K3/30 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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