发明名称 METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image sensing device which prevents a metal contamination of a photoelectric transfer part, has a high production yield, and can be driven at a low voltage with a low power consumption. SOLUTION: In a method for manufacturing the solid-state image sensing device, the photoelectric transfer part and an electric charge transfer element provided with a plurality of electric charge transfer electrodes for transferring electric charges produced by the photoelectric transfer part are formed on a surface of a semiconductor substrate. A formation step of the electric charge transfer electrodes arrayed through a gate oxide film on the semiconductor substrate contains a formation step of a metal film, and the formation step of the metal film is executed after formation of the photoelectric transfer part. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004119794(A) 申请公布日期 2004.04.15
申请号 JP20020282875 申请日期 2002.09.27
申请人 FUJI FILM MICRODEVICES CO LTD;FUJI PHOTO FILM CO LTD 发明人 YASUUMI SADAJI
分类号 H01L21/28;H01L27/148;H01L31/10;(IPC1-7):H01L27/148 主分类号 H01L21/28
代理机构 代理人
主权项
地址