| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a BGA (ball grid array) semiconductor device having a ball-like conduction terminal. <P>SOLUTION: A first glass substrate 4 is stuck on a semiconductor chip 1 including first wiring 3 formed on the side end of the surface side of the semiconductor chip 1 through an insulating film 2 by using a resin 5a. A second glass substrate 6 is stuck on the rear face side of the semiconductor chip 1 by using a resin 5b. A buffer member 7 is formed on the flat part of a second glass substrate 6, and a reverse V-shaped notching surface is formed by notching (cutting) the second glass substrate 6, the resin 5b, the insulating film 2, the first wiring 3, the resin 5a and part of the first glass substrate 4. Second wiring 9 is formed through a titanium film 8 on the notching surface, and a conduction terminal 10 is formed on the second wiring 9 through a protective film 11. <P>COPYRIGHT: (C)2004,JPO |
