FILM PATTERN FORMATION METHOD, FILM PATTERN FORMATION APPARATUS, CONDUCTING FILM WIRING, ELECTROOPTICAL APPARATUS, ELECTRONIC COMPONENT, AND NONCONTACT CARD MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a film pattern formation method for forming a plurality of patterns different in shape in film pattern forming regions on a substrate, and to provide conducting film wiring or the like obtained by using the method. SOLUTION: The film pattern formation method comprises a first surface processing step for adjusting the substrate surface to be liquid-repellent as desired, a first pattern formation step for forming a first wiring 1 (first pattern) on the substrate surface after the first surface processing step, a second surface processing step for decreasing the liquid-repellency of the substrate surface after the first pattern formation step, and a second pattern formation step for forming a second wiring 2 (second pattern) different in shape from the first wiring 1 on the substrate surface after the second surface processing step. COPYRIGHT: (C)2004,JPO