| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board with a solder bump in which a void is hardly formed in the solder bump and which can rigidly connect an electrode of an electronic component to a solder connecting pad via the solder bump. SOLUTION: The method for manufacturing the wiring board with the solder bump includes the steps of forming a solder resistant resin layer 4 having a plurality of solder connecting pads 3 and openings 4a for exposing a centers of the pads 3 on a surface of an insulating board 2, then coating the pads 3 with a solder plating layer 21, then coating the layer 21 with a solder paste 22, and then heating to melt the solder in the paste 2 and the layer 21 to form the solder bumps 5. COPYRIGHT: (C)2004,JPO
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