发明名称 |
Terahertz interconnect system and applications |
摘要 |
An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.
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申请公布号 |
US2004069984(A1) |
申请公布日期 |
2004.04.15 |
申请号 |
US20030462491 |
申请日期 |
2003.06.14 |
申请人 |
ESTES MICHAEL J.;MODDEL GARRET |
发明人 |
ESTES MICHAEL J.;MODDEL GARRET |
分类号 |
G02B6/122;G02B6/42;G11C7/00;H01L23/48;H01L31/0336;(IPC1-7):H01L31/033 |
主分类号 |
G02B6/122 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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