发明名称 Terahertz interconnect system and applications
摘要 An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.
申请公布号 US2004069984(A1) 申请公布日期 2004.04.15
申请号 US20030462491 申请日期 2003.06.14
申请人 ESTES MICHAEL J.;MODDEL GARRET 发明人 ESTES MICHAEL J.;MODDEL GARRET
分类号 G02B6/122;G02B6/42;G11C7/00;H01L23/48;H01L31/0336;(IPC1-7):H01L31/033 主分类号 G02B6/122
代理机构 代理人
主权项
地址