APPARATUS FOR FORMING FILM ON SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: An apparatus for forming a film on a semiconductor substrate is provided to be capable of preventing air from flowing into a chamber through an exposed groove of a susceptor. CONSTITUTION: An apparatus is provided with a chamber(200), a plurality of heaters(204a,204b) installed in the chamber for heating a substrate, and a susceptor(202) installed on the heater for supporting the substrate. At this time, the susceptor has a groove at its lateral portion. The apparatus further includes a protecting line(238) prolonged from the groove to the outside, a thermocouple(230), and an encapsulating part(240) for preventing the inflow of air. Preferably, the encapsulating part is formed between a sheath and the protecting line. Preferably, the encapsulating part is made of Ag or Pb.