发明名称 HEAT TRANSFER DEVICE, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING HEAT TRANSFER DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat transfer device having reduced size and thickness and high heat transfer efficiency in operation, and its manufacturing method. <P>SOLUTION: The device comprises a first substrate 2, a second substrate 3, and a third substrate 4, by which a heat insulating part 14 is formed on one side of a liquid phase passage 7 and a gas phase passage 5 along the liquid phase passage 7 in which a liquid phase operating fluid flows and the gas phase passage 5 in which a gas phase operating fluid flows. The heat insulating part 14 is sealed in a vacuum condition or in the filled condition of gas having lower heat conductivity than materials forming the first substrate 2 and the third substrate 4. The formation of the heat insulating part along the gas phase passage 5 and the liquid phase passage 7 suppresses the giving and reception of heat between each of the gas phase passage 5 and the liquid phase passage 7 and the external of the heat transfer device 1, prevents a phase change of the operating fluid flowing the gas phase passage 5 and the liquid phase passage 7 in each flow passage, stabilizes the flow of the operating fluid and achieves high heat transfer efficiency. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004108760(A) 申请公布日期 2004.04.08
申请号 JP20030272731 申请日期 2003.07.10
申请人 SONY CORP 发明人 HARA MASATERU;SOTOZAKI MINEHIRO
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):F28D15/02 主分类号 F28D15/02
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