| 摘要 |
PROBLEM TO BE SOLVED: To provide a package used for housing an optical semiconductor device, which is capable of keeping the position of a translucent member with high accuracy to the optical semiconductor device, preventing resin burrs from adhering to the translucent member when a base is molded, and protecting the translucent member against damage, such as cracks. SOLUTION: The package used for housing the optical semiconductor device is equipped with the base 1 which is provided with a recess on its top surface and a projection 1a which is provided on the bottom of the recess and where the optical semiconductor device 8 is mounted on its top surface, through-holes 2a which are provided to the side wall of the recess so as to penetrate through it from inside, a recessed part (stepped part) which is provided to all the inner side wall of the recess where the through-holes 2a are bored, a metal member 6 which is fitted into the recessed part so as to be flush with the inner side wall of the recess and provided with a through-hole 6a penetrating through it at its center, and a translucent member 6b bonded to the through-hole 6a of the metal member 6. COPYRIGHT: (C)2004,JPO
|
