| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To finely connect internal electrodes and miniaturize a package by preventing variations in the interval between chips to be connected in a facedown system. <P>SOLUTION: The semiconductor device comprises a first semiconductor chip 10 having a first internal electrode 11 formed on a main surface and a first bump 13 formed on it; a second semiconductor chip 20 having a second internal electrode 21, formed on a main surface and a second bump 24 formed on it; and a spacer-like projection 14 formed at a region, excluding the respective internal electrodes 11, 21 on respective main surfaces of the first and second semiconductor chips 10, 20. The first and second semiconductor chips 10, 20 are stuck, by joining the first and second bumps 13, 24 to each other. The spacer-like projection 14 is in contact with both the first protection film 12, in the first semiconductor chip 10 and a second protection film 23, in the second semiconductor chip 20. <P>COPYRIGHT: (C)2004,JPO</p> |
