发明名称 METHOD FOR CUTTING SUBSTRATE AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid crystal display device by which the accuracy for the cutting position of a substrate can be easily judged and its accuracy is realized without adding a new manufacturing process. SOLUTION: In the method for cutting a substrate having a wiring layer, a section in the cutting position 12 of the substrate and having no wiring layer drawn is provided with a pair of opposing patterns 26a, 26b or 27a, 27b over the cutting position of the substrate. The substrate is cut between the pair of opposing patterns. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004109983(A) 申请公布日期 2004.04.08
申请号 JP20030202566 申请日期 2003.07.28
申请人 SEIKO EPSON CORP 发明人 YOKOUCHI YOSHIO
分类号 G02F1/13;G02F1/1333;G02F1/1345;H01L21/301;(IPC1-7):G02F1/13;G02F1/133;G02F1/134 主分类号 G02F1/13
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