| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic electronic component manufacturing method including a plating step in which Ba is hardly eluded from an electronic component stock when depositing a Sn plating film, and electronic component stocks are hardly stuck to each other by the Sn plating film. SOLUTION: The ceramic electronic component manufacturing method includes a step of forming an electrode on an outer surface of an electronic component stock constituted by using Ba-containing ceramic. The electrode has a Sn plating film, and the Sn plating film is deposited by the electric plating by using a Sn plating bath which includes ions of at least one kind of acid selected from the group consisting of sulfamic acid, alkane-sulfonic acid, alkanol-sulfonic acid, boric-hydrofluoric acid and phenol-sulfonic acid, Sn ions and sulfuric acid ions, while the Sn ion concentration is 0.008-0.84 mol/L, the sulfuric acid ion concentration is 0.02-0.31 mol/L, and pH is 4.1-6.0. COPYRIGHT: (C)2004,JPO
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