发明名称 Semiconductor device comprising an aggregate of semiconductor micro-needles
摘要 <p>On a silicon substrate (1) is formed a silicon dioxide film (5) and then hemispherical grains made of silicon, each having an extremely small diameter, are deposited thereon by LPCVD (6). After annealing the hemispherical grains, the silicon dioxide film is etched using the hemispherical grains as a first dotted mask, thereby forming a second dotted mask composed of the silicon dioxide film. The resulting second dotted mask is used to etch the silicon substrate to a specified depth from the surface thereof, thereby forming an aggregate of semiconductor micro-needles. Since the diameter of each of the semiconductor micro-needles is sufficiently small to cause the quantum size effects as well as has only small size variations, remarkable quantum size effects can be obtained. Therefore, it becomes possible to constitute a semiconductor apparatus with a high information-processing function by using the aggregate of semiconductor micro-needles (quantized region). <IMAGE></p>
申请公布号 EP0893834(B1) 申请公布日期 2004.04.07
申请号 EP19980119139 申请日期 1994.11.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD 发明人 ERIGUCHI, KOJI;KUBOTA, MASAFUMI;NIWA, MASAAKI;NOMURA, NOBORU
分类号 B81B3/00;G01Q70/10;G01Q70/16;G02B6/12;G02B6/124;G11C23/00;H01H1/00;H01L21/308;H01L31/0352;H01L31/18;H01L33/10;H01L33/18;(IPC1-7):H01L33/00;H01L21/30;H01L27/15;H01L31/153;H01L31/173 主分类号 B81B3/00
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