发明名称 |
Semiconductor module |
摘要 |
A plurality of substrates are stacked on top of each other. A flexible cable serially connects the substrates. Semiconductor packages are mounted on the surfaces of the substrates. An adhesive material bonds adjoining semiconductor packages and holds the semiconductor packages in place with respect to each other. The bottommost substrate is provided with external leads by which the semiconductor module is mounted on the motherboard.
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申请公布号 |
US6717275(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20020134427 |
申请日期 |
2002.04.30 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
MATSUURA TETSUYA;KASATANI YASUSHI;ICHIMASA TADASHI |
分类号 |
H01L23/52;H01L23/538;H01L25/10;H01L25/11;H01L25/18;H05K1/14;H05K1/18;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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