发明名称 |
Profiled retaining ring for chemical mechanical planarization |
摘要 |
An invention is provided for a retaining ring for use in a chemical mechanical planarization system. The retaining ring includes an annular retaining ring capable of holding a flatted wafer in position during a CMP operation. The flatted wafer has a first corner and a second corner disposed on a flatted edge of the wafer. Also included is a plurality of profiled teeth disposed along an interior surface of the annular retaining ring. The profiled teeth are separated from each other such that the first comer and the second corner of the wafer do not contact profiled teeth simultaneously at all orientations of the wafer in the retaining ring. In addition, a surface of each tooth that contacts the wafer is inclined so as to form an angle greater than 90° relative to a polishing surface and away from the center of the wafer.
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申请公布号 |
US6716299(B1) |
申请公布日期 |
2004.04.06 |
申请号 |
US20020186944 |
申请日期 |
2002.06.28 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
GOTKIS YEHIEL;OWCZARZ ALEKSANDER;YUNG JEFFREY |
分类号 |
B24B21/04;B24B37/04;B24B41/06;(IPC1-7):B24B5/00;B24B29/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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