发明名称 BAKE APPARATUS
摘要 PURPOSE: A bake apparatus is provided to be capable of constantly loading a wafer at the same position of a tilted heating plate for carrying out a bake process. CONSTITUTION: A bake apparatus includes a heating plate(40) for loading and baking a wafer. The heating plate is tilted as much as a predetermined angle. The bake apparatus further includes a plurality of stoppers(41) at the predetermined upper portions of the heating plate for stopping a sliding wafer. Preferably, the plurality of stoppers are installed at the lower portion of the upper surface of the heating plate. Preferably, the stoppers are formed along the peripheral portion of the heating plate corresponding to the shape of the wafer. Preferably, the heating plate includes more than two lift pins at both sides using the center portion as a reference.
申请公布号 KR20040028148(A) 申请公布日期 2004.04.03
申请号 KR20020059264 申请日期 2002.09.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SEOK GYUN
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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