| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic component packaging equipment which can easily perform electronic component packaging work on a sheet-shaped resin substrate, and to provide an electronic component packaging method. <P>SOLUTION: In the electronic component packaging equipment, an electronic component 7 is bonded to the sheet-shaped resin substrate 2 by using resin 4 for bonding, and bumps of the electronic component 7 are bonded to electrodes formed on the resin substrate 2. In a substrate holding part 5, the resin substrate 2 on which the resin 4 for bonding is spread previously is clamped from the upper and the lower sides by a backup member 13 and a substrate pressing member 15, and deflection is corrected. In this state, the electronic component 7 is subjected to ultrasonic bonding to the resin substrate 2 by using an ultrasonic head 17, and the resin 4 for bonding is heated via the electronic component 7 by using a heating head 18. The clamping of the resin substrate 2 is continued during the ultrasonic bonding and the thermosetting work. As a result, it is not necessary to use a dedicated holder every resin substrate 2, so that electronic component packing work on the sheet-shaped resin substrate 2 is simplified. <P>COPYRIGHT: (C)2004,JPO</p> |
